When LG announced the successor to the G Flex back in January, the specs detailed that the device packed a Qualcomm Snapdragon 810 processor. This alarmed a significant number of people, because despite the anticipation that had been built around Qualcomm's next generation SoC, a number of reports claimed that the S810 had severe overheating issues. Following the G Flex 2 announcement, wariness of the device began to rise, but LG executives stepped forward, admitting that the company did run into some problems with the initial batch of chips but they had been fixed in the time since then.
HTC M9 Benchmark Proves Snapdragon 810 Overheating
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