Memo: ① A company map surrounding artificial diamond substrates, ② A comparison of SiC, GaN, and artificial diamond technologies/markets, ③ Which will take off first, and ④ The winning strategy for Japanese companies—all in one go.
Memo: ① A company map surrounding artificial diamond substrates, ② A comparison of SiC, GaN, and artificial diamond technologies/markets, ③ Which will take off first, and ④ The winning strategy for Japanese companies—all in one go.
This memo summarizes: ① A company map surrounding artificial diamond substrates, ② A comparison of SiC, GaN, and artificial diamond technologies/markets, ③ Which will take off first, and ④ The winning strategy for Japanese companies.
Conclusion
Artificial diamond substrates are not a "dream for next-generation semiconductors," but rather a packaging material to break the limits of heat, high voltage, and high power density. The market is likely to develop in the following order: ① Heat dissipation applications → ② GaN on Diamond/RF/high power applications → ③ Full-fledged diamond semiconductor devices.
In other words, it's not a matter of suddenly replacing SiC or GaN entirely. The first areas to grow will be high value-added areas where "heat is the limit."
The winning companies are not "companies that can make diamonds," but companies that can make diamond substrates usable in mass-production sizes, with low defects, and in a form that is easy to implement.
Key Points to Understand First
There are actually three markets for artificial diamond substrates. Confusing these points will lead to a superficial analysis.
A. The market where diamond itself is used as the semiconductor active layer.
B. The market where diamond is used as a "heat dissipation substrate" for GaN and other materials.
C. The market where diamond is used in quantum, sensor, high-frequency, and special applications.
These three markets have different technical challenges, customers, and distribution channels. Currently, B is the easiest to get started in, followed by C, and finally A.
3. Company Map (Japan/Overseas, Practical Use)
The following is a overall map of the "artificial diamond substrate ecosystem". It includes not only pure substrate manufacturers, but also synthesis, processing, devices, heat dissipation, and quantum technologies. The actual market operates in this chain.
3-1. Japanese Companies
Orbray (formerly Adamant Namiki)
Important in artificial diamond, single crystals, precision processing, quantum, heat dissipation, and electronic materials. A core candidate among Japanese companies.Sumitomo Electric Industries
Important in the context of wide-bandgap semiconductors. Rather than being solely a diamond substrate specialist, it deserves attention in the context of power semiconductors and materials.Mitsubishi Materials: Highly relevant due to its extension of heat, materials, and processing.
Kyocera: Strong connections with packages, substrates, ceramics, and heat dissipation systems.
NGK Spark Plug / Niterra: Compatibility with materials, advanced components, and new semiconductor materials.
Fujimi Incorporated: Extremely important in CMP and polishing. Surface finish will become increasingly important as diamond substrates become widespread.
Disco: Cutting, grinding, and dicing. A key player in hard and brittle material processing.
Tokyo Seimitsu: Important in measurement, processing, and inspection systems.
ULVAC: Important in the context of CVD and vacuum process equipment.
Sumitomo Precision/Precision Processing Related Companies: Can capture peripheral demand in processing and joining high-hardness materials.
J-TEC Group's Ultra-Precision Processing/Surface Modification/Polishing Player: This area is precisely where Japanese precision processing companies have a winning strategy. For diamond substrates, the key to success lies more in "finishing" than in "material strength."
University/National Research Institute-Based Venture Group
Spin-outs from universities such as the University of Tokyo, AIST, Nagoya University, and NIMS are likely to emerge in the future.
3-2. Overseas Companies
Element Six
A global leader in artificial diamonds. The material itself has a very strong presence.IIa Technologies
A major Singaporean company. Indispensable in the context of synthetic diamonds.Diamond Foundry
Highly recognized for artificial diamonds. Significant potential for expansion into semiconductor and thermal applications.Akash Systems
Often attracting attention for GaN on Diamond and high-power/space applications.Advent Diamond
Important in relation to diamond semiconductor devices.Applied Diamond
Attracting attention in diamond materials and thermal applications.NeoCoat
Known for CVD diamond-related work.Diamond Materials GmbH
Important in materials and wafer-related work.Qnami: A leading player in quantum and diamond sensing.
Quantum Diamond Technologies Group: Potential for expansion in the quantum sensing field.
Diatope / Academic Spin-Out Group: The number of Western spin-outs is likely to increase in the future.
Raytheon / Defense Sector: Rapid demand for defense applications in high frequency, high power, and space applications.
Lockheed / Northrop Supply Chain: More of an application-driven driver than a direct manufacturer.
Wolfspeed Sector: Not a primary diamond substrate, but essential as a comparison point with SiC.
Qorvo / RF Player Group: Important as a mounting destination for GaN on Diamond.
MACOM / RF Player Group: Promising in high frequency and high power applications.
Coherent / Laser Sector: Relevant in high-temperature and high-power applications. 30. Research-Implementation Connection Network Around CEA-Leti / imec / Fraunhofer
Although not a company, they cannot be ignored in standardization and implementation evaluation on the eve of mass production.Where is the Main Market?
To put it bluntly, the main market is not the "diamond-only device market," but the "substrate and implementation market for handling high heat."
The reason is simple: even with excellent material properties, widespread adoption as a semiconductor device requires overcoming the following:
• Large-diameter single crystal
• Low defects
• n-type/p-type control
• Electrode formation
• Yield
• Cost
On the other hand, with heat dissipation substrates and GaN on Diamond, performance advantages can be converted into implementation value relatively quickly. This is the initial market.
5. Comparison of SiC, GaN, and Artificial Diamond
5-1. Technology Comparison
SiC
Highest level of maturity. Strong in high voltage and high-temperature operation. Already established in EVs, industrial equipment, and power transmission/distribution.
Its weaknesses are cost, defects, difficulty in processing, and the fact that "it's strong at high temperatures, but not universally applicable."
GaN: Strong in high-frequency, high-speed switching, and small power supplies. Promising for AI server power supplies, rapid charging, and RF applications.
Its weaknesses are that it's not the absolute king of high-voltage resistance and the difficulty of heat treatment. This is where it pairs well with diamond substrates.
Artificial Diamond: Extremely strong in thermal conductivity, dielectric breakdown field, and theoretical performance.
However, the biggest problem is that "its material performance is too strong, but it's still difficult to implement industrially."
5-2. Practical Comparison
Short-to-Medium-Term Mass Production Leading Contenders: SiC, GaN
Short-to-Medium-Term High-Value Niche Leading Contenders: GaN on Diamond, Diamond Heat Spreader
Long-Term Ultimate Candidate: Diamond Semiconductor
5-3. Where to Vitalize
SiC: EV Main Power Supplies, High-Voltage Industrial Applications, Power Conversion
GaN: High Frequency, High-Speed Power Supplies, Miniaturization, AI Server Peripherals
Artificial Diamond: Breaking High Thermal Limits, Space, Defense, High-Power RF, Extreme Power Devices, Quantum/Special Applications
6. How to View the Competitive Structure
Competition in this market is not simply a materials competition.
There are six axes of competition.
① Synthesis Capability: Can they produce high-quality single crystals?
② Large Diameter: Can they increase wafer size?
③ Processing and Polishing: Can they achieve mirror finish, defect suppression, and thinning?
④ Bonding and Packaging: Can they combine with GaN and other materials?
⑤ Customer Connectivity: Where can they fit into defense, communications, power, or quantum applications?
⑥ Price Decline Curve: How low can they reduce prices through mass production?
In short, the winners are not companies with "amazing materials," but companies that can connect materials → processing → packaging → customer applications.
Competitive Prediction
This is quite important.
The next growth will be in companies that "incorporate diamond into GaN/high-temperature applications," rather than "pure diamond semiconductor specialists."
The reason is that the customer's justification for paying is clear.
"It breaks down with heat," "Power output cannot be increased," "Size cannot be reduced."
If these problems can be solved quickly, it will be adopted even at a high price.
Conversely, pure diamond semiconductor device companies, while technically attractive, may have a relatively slow mass production and market start-up.
Therefore, the order of competition can be seen as follows:
Phase 1: Thermal diffusion, high-power RF, space defense
Phase 2: High-performance GaN packaging
Phase 3: Pure diamond semiconductor devices
8. Winning Strategy for Japanese Companies
Japan's winning strategy is not directly "world domination of the material itself," but rather processing, polishing, surface control, bonding, measurement, equipment, and high-reliability packaging.
In fact, Japan is quite strong in these areas.
Artificial diamond substrates cannot be made into products with the material alone.
• How to cut
• How to polish
• How to flatten
• How to bond to other materials
• How to find defects
This is where the competition lies.
Therefore, Japan has a strong possibility of taking the lead in substrate processing, precision surface treatment, and packaging reliability.
What Should We Focus On?
These are the six KPIs to watch going forward.
Wafer Size: Up to what size can it be reliably supplied?
Defect Density: Can it achieve a practical yield?
Cost/Wafer: Is it cost-effective for heat dissipation applications?
Bonding Technology: Can it be reliably bonded with GaN and other materials?
Customer Adoption: Will it be adopted in aerospace, defense, RF, and AI power supplies?
Processing Equipment/Polishing Technology: Where are the mass production bottlenecks?
Conclusion
The essence of artificial diamond substrates is not that they are the "dream material that will come after SiC and GaN," but rather a realistic mounting tool to break through the barriers of heat, high power, and high voltage resistance.
In the short to medium term, heat dissipation, high-power RF, and GaN on Diamond are the priorities. In the long term, pure diamond semiconductor devices are a candidate for major breakthroughs.
This market is not a material battle, but an integrated battle of synthesis, processing, bonding, mounting, and customer applications. Japanese companies have a strong advantage in processing, polishing, surface control, and high-reliability mounting.